General situation and development trend of LED Module industry
1. Industry Overview
LED (light emitting diode) is a kind of light emitting diode, which is a semiconductor light emitting device that can convert electrical energy into light energy. It is made of compounds containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N) and other elements. When electrons and holes recombine, they can radiate visible light.
In the entire LED industry, the upstream of the industry is LED chip epitaxy, the midstream is LED packaging, and the downstream is LED applications. With the gradual expansion of LED downstream application fields, the application range of products is getting wider and wider, which directly affects the midstream packaging.
In recent years, the LED packaging capacity has rapidly improved, and the product range is complete. It can package LED devices of various shapes and colors, including various single tubes, composite tubes, digital displays and SMD devices. Compared with the epitaxial and chip industries, the LED packaging industry is the most competitive, the largest, and the technology level is closest to the international advanced level.
With the rapid development of indium gallium nitride material technology, blue, green and white LEDs based on blue chips have been industrialized. From the scope of application, white LED module is the most widely used LED product. Its appearance has extended the application of LEDs to general lighting (indoor lighting, outdoor lighting), backlighting (widely used in notebook computers, mobile phones, LCD TVs). , LCD display, MP3, MP4, iPod, etc.), indoor and outdoor full color display, special lighting (mining lights, aviation lights, military lights).
However, from the current technical level, any kind of LED chip cannot directly emit white light, and it needs to be realized by light-color composite technology, so its packaging technology is also the most difficult. The packaging of white LEDs, especially the packaging of high-power white LEDs, needs to solve problems in various fields such as optics, thermals, mechanics, electricity, etc., and is the main standard for measuring the technical level of LED packaging companies. A very important part of its conductivity, heat dissipation and mechanical properties depends on the quality of the LED bracket.
2. Future development trends
With the cost and price falling, LED lighting will become the focus of development. Thanks to the improvement of light efficiency, the cost of LED chips can be controlled under the same lighting intensity. In the middle and lower reaches of the industry chain, LED packaging introduces new technologies such as COB (on-board chip packaging) and packaging materials with better heat dissipation performance, thereby further improving the luminous efficiency of packaged devices. LED light sources and lamps are becoming more integrated and designed. It is superior to traditional light sources and also helps to control the cost of the final product.
With the gradual elimination of incandescent lamps worldwide, LED lighting will usher in rare development opportunities and become the focus of the development of the lighting industry. Accelerate the integration of various links in the industry, and gradually increase the market concentration. The upstream of the LED industry is characterized by technology-intensive and capital-intensive features, and the low-end has the characteristics of capital-intensive, technology-intensive and labor-intensive. Low-end small businesses with advantages will find it difficult to continue investing in R & D and market expansion, and it will be difficult to survive in the industry.
In recent years, the LED industry has increased its integration efforts, small businesses have gradually withdrawn, and the number of enterprises within the industry has gradually increased from a few years ago to basically stable. Generally, the quantity has not changed much, but the market concentration has greatly increased. Large and medium-sized enterprises with an output value exceeding 100 million yuan are the main body of packaging enterprises expanding production, accounting for more than 60%. From the perspective of the life cycle of the industry, the industry is transitioning to the late stage of growth. After a few years, it will gradually enter the mature period, forming a number of large companies to lead the market standard and improve product quality. Continuous R & D investment will promote a more complete Industrial chain and increase the added value of product technology.